June 7, 2017
NOVI, Mich., June 6, 2017 /PRNewswire/ — TU-Automotive
Valens, the developer of HDBaseT and co-founder of the HDBaseT Alliance, announced today that it will be demonstrating the distribution of high-throughput content utilizing the company’s in-vehicle networking technology, HDBaseT Automotive and Qualcomm Technologies’ connected car platform, which features the Qualcomm®Snapdragon™ X16 Gigabit LTE modem. The HDBaseT Automotive demonstration will showcase the distribution of data received over the Gigabit LTE modem towards the head unit utilizing a single unshielded twisted pair (UTP) cable, with very low latency and high-resistance to electromagnetic interference/compatibility (EMI/EMC).
Currently, HDBaseT Automotive serves as a key technology that enables high-speed tunneling of audio, video, data, USB and more, with native networking capabilities over a single UTP cable for up to 15m (50ft). Qualcomm Technologies’ connected car reference platform with the Snapdragon X16 LTE modem is designed to assist car manufacturers to rapidly prototype and optimize advanced telematics systems and connected vehicle services, and is the first announced automotive platform that supports download speeds up to 1Gbps over LTE.
The Snapdragon X16 LTE modem supports Gigabit download speeds, up to 10x as fast as first generation 4G LTE devices. The modem is designed to employ sophisticated digital signal processing to pack more bits per transmission with 256-QAM, receives data on four antennas through 4×4 MIMO, and supports up to 4x Carrier Aggregation. All of this comes together to support peak download speeds up to 1 Gbps, helping satisfy the connectivity needs and use cases of the next generation of connected vehicles including high-definition map updates, connected navigation with real-time traffic and road condition information, software upgrades, Wi-Fi hotspot and multimedia streaming.
“A critical element in car connectivity is the infrastructure supporting the transmission of data and content, both from outside as within the car. Valens’ HDBaseT Automotive technology optimizes in-vehicle connectivity with a high-speed, highly secure, 15m/50ft link. The use of Qualcomm Technologies’ connected car reference platform reinforces the importance of in-vehicle connectivity,” said Micha Risling, Sr. Vice President of Marketing and Business Development & Head of the Automotive Business Unit
“As cars become more connected, the range of applications increasingly demands the ability to receive, transmit and distribute data via ultra-reliable low latency connections,” said Nakul Duggal, Vice President of Product Management, Qualcomm Technologies, Inc. “We’re pleased to be working with Valens to demonstrate how their HDBaseT Automotive solution and Qualcomm Technologies’ connected car reference platform are advancing automotive connectivity to deliver the next-generation experiences and mission-critical services that automakers and their customers demand.”
Please visit the HDBaseT Alliance’s booth (B135) at TU-Automotive 2017, to see the demo and learn more.
Established in 2006, Valens provides semiconductor products for the distribution of ultra-high-definition (HD) multimedia content. The company’s HDBaseT technology enables long-reach connectivity of devices over a single cable and is a global standard for advanced digital media distribution. Valens is a private company headquartered in Israel. For more information, visit www.valens.com, or follow @ValensAuto.